Transmission line device using stacked conductive layers

Details Transmission line device using stacked conductive layers Transmission line device using stacked conductive layers

1994-01-28

1996-03-12

Gensler, Paul

Wave transmission lines and networks

Long line elements and components

Strip type

333161, 333162, 336200, H01P 500

Patent

active

054990050

ABSTRACT:
A transmission line device (200) employs a first ground plane (118) that is disposed on a first dielectric substrate (202). A first conductive layer (210) that encloses a first area (213)is disposed on a second dielectric substrate (206), which substrate is positioned substantially adjacent to the first dielectric substrate (202). A second conductive layer (211) that encloses an area corresponding to the first area (213) is disposed on a third dielectric substrate (207), which substrate is positioned substantially adjacent to the second dielectric substrate (206). A coil structure is thereby provided that can be employed in the fabrication of a transmission line device, according to the invention.

REFERENCES:
patent: 3849745 (1974-11-01), Schellenberg et al.
patent: 4494083 (1985-01-01), Josefsson et al.
patent: 4701727 (1987-10-01), Wong
patent: 4916417 (1990-04-01), Ishikawa et al.
patent: 5146191 (1992-09-01), Mandai et al.
patent: 5369379 (1994-11-01), Fujiki

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