Transmission circuit using strip line in three dimensions

Details Transmission circuit using strip line in three dimensions Transmission circuit using strip line in three dimensions

1997-12-05

2000-02-08

Pascal, Robert

Wave transmission lines and networks

Long line elements and components

Strip type

333 33, 174262, H01P 308, H05K 111

Patent

active

060232110

ABSTRACT:
There is provided a transmission circuit using a strip line which can be formed in three dimensions with simple construction and low cost and which has high reliability. A first microstrip line is formed by sandwiching a dielectric substrate 1 between a first strip conductor 2 provided on a top surface of the dielectric substrate 1 and a first grounding conductor 3 provided on a bottom surface of the dielectric substrate 1. A second microstrip line is formed by sandwiching the dielectric substrate 1 between a second strip conductor 4 provided on the bottom surface of the dielectric substrate 1 and a second grounding conductor 5 provided on the top surface of the dielectric substrate 1. The first strip conductor 2 and the second strip conductor 4 are electrically connected to each other by a connecting through hole 11 provided in the dielectric substrate 1.

REFERENCES:
patent: 4494083 (1985-01-01), Josefsson et al.
patent: 4816791 (1989-03-01), Carnahan et al.
patent: 5036301 (1991-07-01), Takao et al.
patent: 5057798 (1991-10-01), Moye et al.
patent: 5229727 (1993-07-01), Clark et al.
patent: 5401912 (1995-03-01), Mattei
patent: 5414222 (1995-05-01), Sen et al.
patent: 5757252 (1998-05-01), Cho et al.

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