Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent
1985-11-14
1986-10-14
Godici, Nicholas P.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
228 561, B23K 300, B23K 306
Patent
active
046167757
ABSTRACT:
Wave soldering machine of the type comprising a frame, at least one solder pot mounted on the frame and equipped with a nozzle designed to produce a wave of solder, a conveyor mounted on the frame and designed to carry the printed circuit boards along a substantially linear path, and a device for adjusting the height of the solder pot, thus permitting the adjustment of the height of the wave with respect to the path, machine wherein the frame comprises a moving track of general direction similar to that of the conveyor and on which is mounted the solder pot, the path and track forming together a predetermined angle of small value, and the track having an inclination as small as possible with respect to the horizontal, and a device for adjusting the position of the solder pot along the moving track.
REFERENCES:
patent: 3386166 (1968-06-01), Tardoskegyi
patent: 4512508 (1985-04-01), Pachschwoll
Godici Nicholas P.
Heinrich Samuel M.
Outillages Scientifiques et de Laboratoires O.S.L. S.A.
LandOfFree
Translatable soldering machine does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Translatable soldering machine, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Translatable soldering machine will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1336511