Transistor-level signal cutting method and structure

Details Transistor-level signal cutting method and structure Transistor-level signal cutting method and structure

2006-11-28

2006-11-28

Kebede, Brook (Department: 2823)

Semiconductor device manufacturing: process

Repair or restoration

C438S598000

Reexamination Certificate

active

07141439

ABSTRACT:
A modifiable circuit structure and its method of formation are disclosed. The modifiable circuit structure electrically couples one portion of an interconnect with another portion of the interconnect through vias disposed in a dielectric layer. The combination of the modifiable circuit structure, the interconnect portions, and the vias provide a signal path between transistors in an integrated circuit. In one embodiment the modifiable circuit structure is a polysilicon feature formed over regions of a semiconductor substrate. In an alternative embodiment, the modifiable circuit structure is a diffusion region formed in region the semiconductor substrate.

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