Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate
2006-03-14
2006-03-14
Nhu, David (Department: 2818)
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
C438S680000
Reexamination Certificate
active
07012028
ABSTRACT:
Transistor fabrication methods (50) are presented in which shrinkable sidewall spacers (120) are formed (66, 68) along sides of a transistor gate (114), and a source/drain implant is performed (74) after forming the sidewall spacer (120). The sidewall spacer width is then reduced by annealing the shrinkable sidewall spacer material (76) following the source/drain implant (74).
REFERENCES:
patent: 5019882 (1991-05-01), Solomon et al.
patent: 5241197 (1993-08-01), Murakami et al.
patent: 5683934 (1997-11-01), Candelaria
patent: 5863827 (1999-01-01), Joyner
patent: 5882981 (1999-03-01), Rajgopal et al.
patent: 5899719 (1999-05-01), Hong
patent: 6004871 (1999-12-01), Kittl et al.
patent: 6087241 (2000-07-01), St. Amand et al.
patent: 6211064 (2001-04-01), Lee
patent: 6214699 (2001-04-01), Joyner
patent: 6261964 (2001-07-01), Wu et al.
patent: 6284233 (2001-09-01), Simon et al.
patent: 6284626 (2001-09-01), Kim
patent: 6284633 (2001-09-01), Nagabushnam et al.
patent: 6355955 (2002-03-01), Gardner et al.
patent: 6406973 (2002-06-01), Lee
patent: 6573172 (2003-06-01), En et al.
patent: 6607950 (2003-08-01), Henson et al.
patent: 6870225 (2005-03-01), Bryant et al.
patent: 2003/0111699 (2003-06-01), Wasshuber et al.
U.S. Appl. No. 10/899,360, filed Jul. 26, 2004, Haowen Bu et al.
Bu Haowen
Chidambaram PR
Khamankar Rajesh
Brady III W. James
McLarty Peter K.
Nhu David
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
LandOfFree
Transistor fabrication methods using reduced width sidewall... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Transistor fabrication methods using reduced width sidewall..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Transistor fabrication methods using reduced width sidewall... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3543717