1988-08-18
1990-08-21
Davie, James W.
357 80, 357 81, H01L 2328, H01L 2348
Patent
active
049504274
ABSTRACT:
A transistor comprising a radiator plate continuous to a base terminal, a plate member made of thermally conductive material, and secured on the radiator plate, a transistor pellet secured on the plate member, a metal lead wire for connecting a base electrode of the transistor pellet to the radiator plate, and a metal lead wire for connecting the upper side of the plate member to the collector terminal.
REFERENCES:
patent: 3829598 (1974-08-01), Darnell
patent: 4482913 (1984-11-01), Burke et al.
Y. Kurokawa et al., "AIN Substrates with High Thermal Conductivity", IEEE Transactions on Components, Hybrids and Manufacturing Technology, vol. CHMT-8, No. 2, Jun. 1985, pp. 247-252.
Davie James W.
Kabushiki Kaisha Toshiba
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