Heat exchange – With valve or movable deflector for heat exchange fluid flow – With by-pass of heat exchanger or heat exchanger section
Patent
1976-04-19
1977-09-06
James, Andrew J.
Heat exchange
With valve or movable deflector for heat exchange fluid flow
With by-pass of heat exchanger or heat exchanger section
357 74, 165 32, 165 80, 165105, 174 16HS, H01L 2302, H01L 2504
Patent
active
040471985
ABSTRACT:
A micro-electronic package which is capable of operating with power densities extending at least to 10 kilowatts per square centimeter comprises a sealed enclosure coupled to an external heat sink and electronic devices and circuitry within the enclosure. Electrical leads extend from the electronic devices and circuitry to the outside of the enclosure to couple the devices and circuitry into a larger electrical function. A dielectric powder is adhered as a complete and conformal coating substantially to all interior surfaces of the enclosure and to all exposed surfaces of the electronic devices and circuitry, and functions as a heat pipe wick. A dielectric working fluid within the enclosure, therefore, can intimately contact all the interior and exposed surfaces to minimize the occurrence of local hot spots on the electronic devices and circuitry and to maximize heat transfer therefrom to the external heat sink.
REFERENCES:
patent: 3673306 (1972-06-01), Kirkpatrick
Investigation of Novel Heat Removal Techniques for Power Transistors, ECOM Technical Report 9-73.
The Heat Pipe; by K. T. Feldman et al., Mechanical Engineering; pp. 30-33, Feb. 67.
Fritz, Jr. John E.
Nelson Lloyd A.
Sekhon Kalwant S.
Hughes Aircraft Company
James Andrew J.
MacAllister W. H.
Sternfels Lewis B.
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