Transistor cooling by heat pipes

Details Transistor cooling by heat pipes Transistor cooling by heat pipes

1977-07-01

1978-08-15

Gilden, Leon

Metal working

Method of mechanical manufacture

Electrical device making

427105, H01B 1900

Patent

active

041061888

ABSTRACT:
A micro-electronic package which is capable of operating with power densities extending at least to 10 kilowatts per square centimeter comprises a sealed enclosure coupled to an external heat sink and electronic devices and circuitry within the enclosure. Electrical leads extend from the electronic devices and circuitry to the outside of the enclosure to couple the devices and circuitry into a larger electrical function. A dielectric powder is adhered as a complete and conformal coating substantially to all interior surfaces of the enclosure and to all exposed surfaces of the electronic devices and circuitry, and functions as a heat pipe wick. A dielectric working fluid within the enclosure, therefore, can intimately contact all the interior and exposed surfaces to minimize the occurrence of local hot spots on the electronic devices and circuitry and to maximize heat transfer therefrom to the external heat sink.

REFERENCES:
patent: 3646374 (1972-02-01), Jordon et al.
patent: 3673306 (1972-06-01), Kirkpatrick
Investigation of Novel Heat Removal Techniques for Power Transistors, ECOM Technical Report 9-1973.
The Heat Pipe by K. T. Feldman et al., Mechanical Engineering, pp. 30-33, 2-1967.

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