Compositions – Electrically conductive or emissive compositions – Free metal containing
Patent
1996-08-28
1998-12-29
Kopec, Mark
Compositions
Electrically conductive or emissive compositions
Free metal containing
252513, 252514, 419 56, 75303, H01B 122, C21B 302
Patent
active
058536221
ABSTRACT:
An inventive method for electrical and thermal electronic component attachment is disclosed. The combination of transient liquid phase sintering (TLPS) and a permanent adhesive flux binder provides the advantages of both conventional soldering technology and conductive adhesives. This hybrid approach delivers electrical and thermal conduction through sintered metal joints and mechanical properties based on a tailorable polymer matrix. These transient liquid phase sintering conductive adhesives can utilize conventional dispensing, placement, and processing equipment. During the reflow process, metal powders in the composition undergo interparticle sintering as well as alloying to the contact pads. This process produces a strong mechanical, thermal, and electrical interconnect which ensures good conductivity that is also resistant to humidity and temperature cycling.
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Capote M. Albert
Gallagher Catherine
Matijasevic Goran
Kopec Mark
Ormet Corporation
Reiter Stephen E.
Stewart Ramsey R.
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