Transformer implementation using bonding wires

Details Transformer implementation using bonding wires Transformer implementation using bonding wires

2006-08-15

2006-08-15

Pascal, Robert (Department: 2817)

Amplifiers

With semiconductor amplifying device

Including balanced to unbalanced circuits and vice versa

Reexamination Certificate

active

07091791

ABSTRACT:
The use of the magnetic coupling between bonding wires can be advantageously used to transform a differential signal to a single-ended signal. Because bonding wires are very good conductors, this differential to single-ended signal transformation can be performed with minimal signal loss. Moreover, because bonding wires are already part of an integrated circuit package, both system cost and board resources are minimized. The magnetic coupling between bonding wires can also be used to combine the power of a plurality of amplifiers. This magnetic coupling can also be used to provide a single-ended to differential signal transformation.

REFERENCES:
patent: 6593814 (2003-07-01), Donig
patent: 6639462 (2003-10-01), Luu
patent: 2003/0205778 (2003-11-01), Yeo et al.
patent: 2004/0111881 (2004-06-01), Yang et al.
patent: 2004/0266059 (2004-12-01), Wight et al.
Aoki et al.: “Fully Integrated CMOS Power Amplifier Design Using The Distributed Active-Transformer Architecture”, IEEE Journal of Solid-State Circuits, vol. 37, No. 3, Mar. 2002, pp. 371-383.

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