Transferring device and transferring method

Details Transferring device and transferring method Transferring device and transferring method

2011-06-28

2011-06-28

Mazumdar, Sonya (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With work feeding or handling means

C156S362000, C156S363000, C156S537000, C156S556000

Reexamination Certificate

active

07967048

ABSTRACT:
A transferring device10for transferring plate-like members such as a semiconductor wafer and the like among the first table T1, the second table T2and the third table T3. The transferring device10includes a supporting unit provided with a supporting face for the semiconductor wafer W, and a multi joint robot12for transferring the supporting unit11. The supporting face includes an adhesive sheet S in which an adhesive layer A is laminated on a sheet base material SB, and transferring among the table T1through T3can be performed through sticking and peeling operation between the adhesive sheet S and the semiconductor wafer.

REFERENCES:
patent: 6663740 (2003-12-01), Yamasaki
patent: 6863590 (2005-03-01), Kobayashi
patent: 7520309 (2009-04-01), Priewasser
patent: 7611600 (2009-11-01), Tsujimoto et al.
patent: 2006/0231202 (2006-10-01), Sakata et al.
patent: 2008/0011412 (2008-01-01), Tsujimoto et al.
patent: 2008/0044258 (2008-02-01), Akechi
patent: 10-242249 (1998-09-01), None
patent: 10242249 (1998-09-01), None
patent: WO 2005106945 (2005-11-01), None
English translation of JP 10-242249, Mori et al.—Sep. 11, 1998.

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