Transferred flexible integrated circuit

Details Transferred flexible integrated circuit Transferred flexible integrated circuit

1996-07-11

2000-02-22

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438457, 257679, H01L 2144

Patent

active

060279583

ABSTRACT:
Integrated circuits for use in electronic devices requiring high density packaging are fabricated to provide highly flexible and ultra-thin devices having a variety of applications. The flexible circuits have dimensions up to several centimeters in surface area and thicknesses of a few microns. These circuits are fabricated using transfer techniques which include the removal of VLSI circuits from silicon wafers and mounting of the circuits on application specific substrates.

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