Transferable solder bumps for interconnect and assembly of MCM s

Details Transferable solder bumps for interconnect and assembly of MCM s Transferable solder bumps for interconnect and assembly of MCM s

1994-04-25

1995-08-08

Wieder, Kenneth A.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

205123, 257419, G01R 104, C25D 502, H01C 2348, H01C 2944

Patent

active

054402395

ABSTRACT:
The invention uses transferable solder bump connection techniques in combination with a disposable test board to test and burn-in "as received" (i.e., untested) dies. Using transferable solder bumps, a die is first attached to the top of a disposable test board. The test board can be designed to allow 100% functional testing of the die as well as burn-in. Dies that successfully complete the test and burn-in process are considered to be "known good dies." Next, heat is applied to remove the known good die from the test board. A property of the invention is that solder bumps transfer with the die such that it can be used immediately in a flip-chip configuration and affixed to a MCM or other circuit board.

REFERENCES:
patent: 5189505 (1993-02-01), Bartelink
patent: 5217597 (1993-06-01), Moore et al.
Ron Iscoff, "Wire Bonders--Stretched to the Max?", Semiconductor International, Feb. 1993.
Linda Becker (News & Events), "Flip Chip Eliminates Package" Interconnection Technology, Sep. 1993 edition, p. 9.
Howard W. Markstein, "Multichip Modules Pursue Wafer Scale Performance," Electronic Packaging & Production, Oct. 1991, pp. 40-45.
Rodney Myrvaagnes, "Which comes first, known-good die or multichip modules?" Electronic Products (Outlook), Nov. 1992, p. 16.
BPA Technology & Management, Ltd., System 2000 "Flip Chip", Advanced Assembly-Technology, Jul. 1993, pp. 52-54.
Ron Iscoff, (Assembly & Packaging News), "Convention Wire Bonders Reaching Technological Limits," Semiconductor International, p. 68. Feb. 1993.

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