Transferable micro spring structure

Details Transferable micro spring structure Transferable micro spring structure

2003-12-19

2008-08-12

McDonald, Rodney G (Department: 1795)

Etching a substrate: processes

Forming or treating an article whose final configuration has...

C216S002000, C216S033000, C204S192150, C204S192300, C438S052000

Reexamination Certificate

active

07410590

ABSTRACT:
A method for mounting the micro spring structures onto cables or contact structures includes forming a spring island having an “upside-down” stress bias on a first release material layer or directly on a substrate, forming a second release material over at least a portion of the spring island, and then forming a base structure over the second release material layer. The micro spring structure is then transferred in an unreleased state, inverted such that the base structure contacts a surface of a selected apparatus, and then secured (e.g., using solder reflow techniques) such that the micro spring structure becomes attached to the apparatus. The spring structure is then released by etching or otherwise removing the release material layer(s).

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