Transfer sheet for making printed-wiring board by injection mold

Details Transfer sheet for making printed-wiring board by injection mold Transfer sheet for making printed-wiring board by injection mold

1990-06-07

1992-04-14

Ryan, Patrick J.

Stock material or miscellaneous articles

Layer or component removable to expose adhesive

Halogen containing compound

428209, 4284111, 428413, 428457, 428901, 156233, B32B 300

Patent

active

051047071

ABSTRACT:
A transfer sheet for making a printed-wiring board by injection molding which is free from circuit damage during injection molding and has excellent releasability comprises a carrier film, a copper foil circuit, and a releasing layer provided between the carrier film and the copper foil circuit. Preferably, said releasing layer has a T-type peeling strength between the carrier film and the copper foil circuit of 0.025-0.25 kg/25 mm. A method for producing such transfer sheet comprises coating a releasing layer on a carrier film, then contact-bonding a copper foil thereto with heat, pattern-printing an etching resist on the resulting laminate film, and subjecting it to etching to form a copper foil circuit.

REFERENCES:
patent: 4306925 (1981-12-01), Lebow et al.
patent: 4357395 (1982-11-01), Lifshin et al.
patent: 4383003 (1983-05-01), Lifshin et al.
patent: 4455181 (1984-06-01), Lifshin et al.
patent: 4937278 (1990-06-01), Besso
patent: 4969257 (1990-11-01), Sato et al.

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