Transfer sheet and wiring board using the same, and method...

Details Transfer sheet and wiring board using the same, and method... Transfer sheet and wiring board using the same, and method...

2006-02-21

2006-02-21

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

C428S209000, C428S352000, C428S353000, C428S609000, C428S612000, C156S329000

Reexamination Certificate

active

07001662

ABSTRACT:
A transfer sheet of the present invention includes a resin film having a glass transition temperature of not lower than 60° C., a silicone resin layer formed on the resin film, and a metal wiring pattern formed on the silicone resin layer. The metal wiring pattern has an exposed face that forms a roughened face, and the roughened face has a ten-point average surface roughness (Rz) of 2 μm or more, while a face of the wiring pattern, which is in contact with the silicone resin layer, has a surface roughness (Rz) lower than that of the exposed face. Thereby, the present invention provides a transfer sheet that has improved transfer performance for enabling transferring at low temperature, and improved dimensional stability and also a via-connection reliability. The present invention provides also a wiring board using the transfer sheet and a method of manufacturing the same.

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