Transfer sheet and process for making a circuit substrate

Details Transfer sheet and process for making a circuit substrate Transfer sheet and process for making a circuit substrate

1988-09-06

1990-11-13

Hall, Carl E.

Metal working

Method of mechanical manufacture

Electrical device making

29848, 156631, 427 96, H05K 328

Patent

active

049692577

ABSTRACT:
A transfer sheet includes an electrodeposited metal foil having a smooth surface and a rough surface attached to a heatproof flexible base sheet. Using such a transfer sheet, a circuit substrate is formed by etching the electrodeposited metal foil to form a circuit pattern, placing the transfer sheet into a cavity of a mold in such a manner that the rough surface of the circuit pattern faces an inside of the mold cavity, pouring a melting resin into the mold cavity to form a molded article, and peeling the transfer sheet from the molded article so that the circuit pattern remains on the resin base.

REFERENCES:
patent: 3372474 (1968-03-01), Polley et al.
patent: 4354895 (1982-10-01), Ellis
patent: 4789423 (1988-12-01), Pelligrino

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