Transfer molding process for encapsulating semiconductor devices

Details Transfer molding process for encapsulating semiconductor devices Transfer molding process for encapsulating semiconductor devices

1995-01-10

1997-06-03

Jordan, Charles T.

Plastic and nonmetallic article shaping or treating: processes

Direct application of fluid pressure differential to...

Producing multilayer work or article

26427211, 26427217, 264316, 264338, B29C 4702

Patent

active

H00016543

ABSTRACT:
The present invention relates to an improved transfer molding method for encapsulating semiconductor, electrical and optical devices with epoxy or other thermoset resins wherein liner film is provided over the surfaces of the package cavities, runners, and pot prior to inserting the preform tablet in the pot and the devices in the package cavities.

REFERENCES:
patent: 4442056 (1984-04-01), Slepcevic
patent: 4900501 (1990-02-01), Saeki et al.
patent: 4956141 (1990-09-01), Allen et al.
patent: 4965037 (1990-10-01), Weaver et al.
patent: 4983110 (1991-01-01), Yoshida et al.
patent: 5052907 (1991-10-01), Matumoto et al.
patent: 5098626 (1992-03-01), Pas
patent: 5164144 (1992-11-01), Rose
patent: 5226997 (1993-07-01), Vallier
patent: 5302101 (1994-04-01), Nishimura
patent: 5350553 (1994-09-01), Glaser et al.
patent: 5401457 (1995-03-01), Valyi
Semiconductor Packaging Update, 1994, vol. 9, No. 6 (ISSN: 0889-9193).

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