Transfer molding method and system for electronic devices

Details Transfer molding method and system for electronic devices Transfer molding method and system for electronic devices

2008-07-15

2010-11-09

Del Sole, Joseph S (Department: 1791)

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

C264S275000, C264S272110, C425S112000, C425S125000, C425S116000

Reexamination Certificate

active

07829004

ABSTRACT:
A method and system for molding an electronic device which is located next to a molding cavity and clamped to the molding cavity during molding, comprising providing molding compound in a mold supply pot, discharging the molding compound from the mold supply pot into a runner, and distributing the molding compound through the runner into the molding cavity in order to fill the molding cavity. A movable surface comprised in the molding cavity is positioned to form a first gap between the movable surface and the electronic device when the molding cavity is being filled. After filling the molding cavity with molding compound, the movable surface is driven to form a second gap between the movable surface and the electronic device which is smaller than the first gap, thereby compressing the molding compound in the molding cavity. A molded electronic device thus produced is then separated from the molding cavity.

REFERENCES:
patent: 3594463 (1971-07-01), Hestehave
patent: 4618466 (1986-10-01), McGlashen et al.
patent: 4954301 (1990-09-01), Saeki et al.
patent: 4954307 (1990-09-01), Yokoyama
patent: 5049055 (1991-09-01), Yokoyama
patent: 5133921 (1992-07-01), Yokoyama
patent: 5603879 (1997-02-01), Osada et al.
patent: 5783134 (1998-07-01), Yabe et al.
patent: 6258314 (2001-07-01), Oida et al.
patent: 6261501 (2001-07-01), Miyagawa et al.
patent: 6491509 (2002-12-01), Schad et al.
patent: 6518204 (2003-02-01), Yamakawa et al.
patent: 6743389 (2004-06-01), Miyajima et al.
patent: 7651958 (2010-01-01), Morita et al.
patent: 2001/0013424 (2001-08-01), Takase et al.
patent: 2002/0015748 (2002-02-01), Miyajima et al.
patent: 2004/0026823 (2004-02-01), Thummel
patent: 2005/0285306 (2005-12-01), Tsuchida
patent: 2006/0119001 (2006-06-01), Thummel
patent: 2008/0308969 (2008-12-01), Ogata et al.
patent: 2009/0045548 (2009-02-01), Venrooij et al.

Affiliated with

Also associated with

Rating

Transfer molding method and system for electronic devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Transfer molding method and system for electronic devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Transfer molding method and system for electronic devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4244136