Transfer molding apparatus and method for manufacturing...

Details Transfer molding apparatus and method for manufacturing... Transfer molding apparatus and method for manufacturing...

2007-06-29

2009-12-01

Lindsay, Jr., Walter L (Department: 2812)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

Reexamination Certificate

active

07625768

ABSTRACT:
A transfer molding apparatus, wherein said top-half mold and said bottom-half mold form a plurality of cavities interconnected, and wherein said pressure adjusting means reduces the pressure of the cavities every time a specified amount of resin is supplied into any one of a plurality of cavities.

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