Transfer molding apparatus and method for manufacturing...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

10890222

ABSTRACT:
A method of transfer molding, wherein a top-half mold and a bottom-half mold of an apparatus form a plurality of cavities interconnected, and wherein a pressure adjuster reduces the pressure of the cavities every time a specified amount of resin is supplied into any one of a plurality of cavities.

REFERENCES:
patent: 3741700 (1973-06-01), Hutchinson et al.
patent: 3836303 (1974-09-01), Horley
patent: 4038004 (1977-07-01), Hartmann
patent: 4426341 (1984-01-01), Tsuzuku et al.
patent: 4900485 (1990-02-01), MuraKami
patent: 4954301 (1990-09-01), Saeki et al.
patent: 5164335 (1992-11-01), Sato et al.
patent: 5225373 (1993-07-01), Takahashi et al.
patent: 5371044 (1994-12-01), Yoshida et al.
patent: 5454991 (1995-10-01), Brew
patent: 5626887 (1997-05-01), Chou et al.
patent: 5690885 (1997-11-01), Fierkens
patent: 5851559 (1998-12-01), Scribner et al.
patent: 5856211 (1999-01-01), Tonazzi et al.
patent: 5971737 (1999-10-01), Sharp
patent: 6267577 (2001-07-01), Nishi et al.
patent: 6444035 (2002-09-01), Nowak et al.
patent: 6495083 (2002-12-01), Weber
patent: 6767484 (2004-07-01), Nishi et al.
patent: 6909929 (2005-06-01), Farnworth et al.
patent: 2002/0160363 (2002-10-01), McDevitt et al.
patent: 2003/0064422 (2003-04-01), McDevitt et al.
patent: 2003/0143780 (2003-07-01), Shirasaka
patent: 2004/0248328 (2004-12-01), Nishi et al.
patent: 05-175264 (1993-07-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Transfer molding apparatus and method for manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Transfer molding apparatus and method for manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Transfer molding apparatus and method for manufacturing... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3827573

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.