Transfer method of functional region, LED array, LED printer...

Details Transfer method of functional region, LED array, LED printer... Transfer method of functional region, LED array, LED printer...

2011-05-17

2011-05-17

Nguyen, Dao H (Department: 2818)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C438S030000, C438S149000, C438S421000, C438S455000, C438S459000, C438S460000, C438S462000, C438S690000, C257S084000, C257S088000, C257S258000, C257S288000, C257SE21211, C257SE21409, C257SE21482, C257SE33001

Reexamination Certificate

active

07943488

ABSTRACT:
A method includes placing a first bonding layer on at least one of a first functional region bonded on a release layer with a light releasable adhesive layer on a first substrate, and a transfer region on a second substrate; bonding the first functional region to the second substrate by the first bonding layer; irradiating the release layer with light with a light blocking member being provided to separate the first substrate from the first functional region at the release layer; placing a second bonding layer on at least one of a second functional region on the first substrate, and a transfer region on the release layer or a transfer region on a third substrate; bonding the second functional region to the second substrate or the third substrate by the second bonding layer; and separating the first substrate from the second functional region at the release layer.

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patent: 2006/0246636 (2006-11-01), Imai et al.
patent: 2010/0165446 (2010-07-01), Danner et al.
patent: 2003-174041 (2003-06-01), None
patent: 2004-311765 (2004-11-01), None
patent: 2006-53171 (2006-02-01), None

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