Stock material or miscellaneous articles – All metal or with adjacent metals – Foil or filament smaller than 6 mils
Patent
1980-08-22
1982-11-02
Kimlin, Edward C.
Stock material or miscellaneous articles
All metal or with adjacent metals
Foil or filament smaller than 6 mils
428612, 428914, 204 35R, 156233, 156249, 156DIG76, B21C 3700, C25D 704, B21D 3900, B32B 324
Patent
active
043573959
ABSTRACT:
A copper-clad laminate having special utility in printed circuit board production because of its extremely smooth and virtually pinhole-free surface is made by vapor depositing a copper film on a layer of silica on an aluminum carrier sheet, electrodepositing a layer of copper on the film to form a foil, bonding the foil to a substrate and finally stripping the foil and substrate laminate from the silica-coated carrier sheet.
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Pellegrino news item, (Electronics Packaging and Production, vol. 18, No. 11, p. 125, Nov. 1978).
Transactions of the Institute of Metal Finishing, by D. J. Arrowsmith (vol. 48, p. 88, 1970).
Cargioli Joseph D.
Lifshin Eric
Schroder Stephen J.
Wong Joe
Davis Jr. James C.
Falasco L.
General Electric Company
Kimlin Edward C.
MaLossi Leo I.
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