Transfer lamination of copper thin sheets and films, method and

Details Transfer lamination of copper thin sheets and films, method and Transfer lamination of copper thin sheets and films, method and

1980-09-22

1983-05-10

Lewis, Michael L.

Stock material or miscellaneous articles

All metal or with adjacent metals

Having magnetic properties, or preformed fiber orientation...

428623, 428624, 428631, 428 32, 428658, 428674, 174 685, B32B 1520

Patent

active

043830030

ABSTRACT:
A copper-clad laminate having special utility in the production of high resolution printed circuit patterns by either subtractive or semi-additive processing is made by vapor depositing a film of zinc on a copper film on a silica-coated aluminum carrier sheet, vapor depositing a silica film on the resulting zinc-copper foil, bonding the resulting body to a substrate and then stripping the silica-coated aluminum carrier sheet from the copper-clad laminate.

REFERENCES:
patent: 2916400 (1959-12-01), Homer et al.
patent: 3237271 (1966-03-01), Arnold et al.
patent: 3857681 (1974-12-01), Yates et al.
patent: 3984598 (1976-10-01), Sarazin et al.
patent: 4049481 (1977-09-01), Morisaki
patent: 4153518 (1979-05-01), Holmes et al.
patent: 4193849 (1980-03-01), Sato
Pellegrino news item, (Electronics Packaging and Production, vol. 18, No. 11, p. 125, Nov. 1978).
"Growth and Perfection of Crystals" by R. H. Doremus, B. W. Roberts and David Turnbull, (Proceedings of an International Conference on Crystal Growth, held at Cooperstown, N.Y., Aug. 27-29, 1958), pp. 26, 27 and 28.
"Adhesion of Electroformed Copper and Nickel to Plastic Laminates", (Transactions of the Institute of Metal Finishing) by D. J. Arrowsmith, (vol. 48, p. 88, 1970).

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