Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With cutting – punching – piercing – severing – or tearing
Reexamination Certificate
2006-06-13
2006-06-13
Osele, Mark A. (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With cutting, punching, piercing, severing, or tearing
C156S577000, C156S579000, C118S076000, C242S160400, C242S171000, C242S588600
Reexamination Certificate
active
07059374
ABSTRACT:
A transfer device comprises a transfer head K that makes transfer paste T contact with a target object such as a paper or a leaf to which the transfer paste T is to be transferred, a pair of side panels11, 12that tightly hold the transfer head K and the transfer paste T, and a head cap C that is rotatable between a transfer head covering position (P) where a distal end portion Ka of the transfer head K can be covered and a transfer head expose position (q) where the distal end portion Ka of the transfer head K can be exposed, wherein a rotary support shaft C11arranged on the head cap C is axially mounted on through holes110a, 120aformed on the side panels11, 12and the head cap C is tightly held by the side panels11, 12.
REFERENCES:
patent: D449858 (2001-10-01), Liu
patent: 6321815 (2001-11-01), You
patent: D465241 (2002-11-01), Suzuki
patent: D466158 (2002-11-01), Suzuki
patent: D475746 (2003-06-01), Ono
patent: D475747 (2003-06-01), Ono
patent: D485302 (2004-01-01), Bain
patent: 2003/0062135 (2003-04-01), Takahashi
patent: 2005/0056374 (2005-03-01), Marschand et al.
patent: 2002-178694 (2002-06-01), None
patent: 2003-54190 (2003-02-01), None
Mitsui Takashi
Shima Hideto
Banner & Witcoff , Ltd.
Kokuyo Co. Ltd.
Osele Mark A.
LandOfFree
Transfer device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Transfer device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Transfer device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3658364