Transfer coating process for manufacture of printing circuits

Details Transfer coating process for manufacture of printing circuits Transfer coating process for manufacture of printing circuits

1974-08-23

1976-05-11

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

29625, 156237, 156238, 156241, 156246, 174 685, 204 30, 252 792, 427 96, 427304, 427306, 427331, 427352, 428901, H05K 318, B05D 724, C23C 302, H05K 300

Patent

active

039560414

ABSTRACT:
There is provided a process for producing resin rich surfaces of desired and specified thickness and physical, chemical, electrical and/or optical properties involving the use of a transfer base material to move a viscous, liquid, hardenable composition after partial hardening into a non-tacky state into contact with the surface of a second, permanent base, completing the hardening of the composition into a resin-rich surface layer adhering to the second base and subsequently removing the transfer base therefrom. In specific embodiments, the permanent base itself can be hardenable and complete hardening is effected simultaneously; the surface layer can be an adhesive layer; and the surface layer can be catalytic throughout to electroless metal deposition.

REFERENCES:
patent: 3539424 (1970-11-01), Tashlick
patent: 3551241 (1970-12-01), Heeb et al.
patent: 3575754 (1971-04-01), Duerden et al.
patent: 3625758 (1971-12-01), Stahl et al.
patent: 3650880 (1972-03-01), Tieniber
patent: 3713935 (1973-01-01), Grecchi
patent: 3799802 (1974-03-01), Schneble, Jr. et al.

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