Transfer body and method using the same

Details Transfer body and method using the same Transfer body and method using the same

2006-08-01

2006-08-01

Ahmed, Shamim (Department: 1765)

Etching a substrate: processes

Adhesive or autogenous bonding of two or more...

C216S036000, C216S067000, C156S230000, C438S213000

Reexamination Certificate

active

07083739

ABSTRACT:
There is disclosed a transfer body including at least a peelable layer, a transparent conductive layer and an adhesive layer all sequentially laminated on a supporting body, wherein the supporting body has a heat resisting property enough to withstand heat treatment to the layers on the supporting body and a large rigidity compared with an opponent member to which the layers are to be transferred, and wherein the peelable layer is formed to have a pull strength of 100 g/cm or more.

REFERENCES:
patent: 5246804 (1993-09-01), Furukawa et al.
patent: 5322832 (1994-06-01), Takeyama et al.
patent: 6194348 (2001-02-01), Onishi et al.
patent: 6287672 (2001-09-01), Fields et al.
patent: 11-024081 (1999-01-01), None

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