Plastic article or earthenware shaping or treating: apparatus – Means applying electrical or wave energy directly to work – Radiated energy
Reexamination Certificate
2006-05-24
2008-11-11
Gupta, Yogendra (Department: 1791)
Plastic article or earthenware shaping or treating: apparatus
Means applying electrical or wave energy directly to work
Radiated energy
C425S385000
Reexamination Certificate
active
07448862
ABSTRACT:
A transcript apparatus having a table11having a placement surface on which a forming material13is placed; a die holder205,disposed in opposition to the table, to fixedly hold a transcription die41;a first gimbal member201having one side to hold the die holder body and the other side formed with a convex spherical surface, a second gimbal member203formed with a concave spherical surface facing the convex spherical surface, the gimbal mechanism guiding ultraviolet rays therein; a movable body19,holding the second gimbal member, that is movable in a vertical direction to the placement surface; attitude adjustment and holder means to adjust and hold an attitude of the first gimbal member; and an ultraviolet ray path to guide ultraviolet rays emitted from an ultraviolet ray generator42onto the forming material through the transcription die.
REFERENCES:
patent: 3828842 (1974-08-01), Tagnon
patent: 4316712 (1982-02-01), Medendorp
patent: 4878826 (1989-11-01), Wendt
patent: 4907956 (1990-03-01), Ezaki et al.
patent: 4969812 (1990-11-01), Brown
patent: 5496433 (1996-03-01), Miyashita et al.
patent: 6364648 (2002-04-01), Bishop et al.
patent: 6416311 (2002-07-01), Springer et al.
patent: 6699425 (2004-03-01), Reuther et al.
patent: 6808443 (2004-10-01), Halley
patent: 7070405 (2006-07-01), Sreenivasan et al.
patent: 7140861 (2006-11-01), Watts et al.
patent: 7150622 (2006-12-01), Choi et al.
patent: 7204686 (2007-04-01), Chung et al.
patent: 2004/0200368 (2004-10-01), Ogino et al.
patent: 2005/0089597 (2005-04-01), Ito
patent: 2006/0037406 (2006-02-01), Dharia
patent: 2006/0193938 (2006-08-01), Iimura et al.
patent: 2006/0233906 (2006-10-01), Kokubo et al.
patent: 10 2006 018 139 (2007-03-01), None
patent: 2004-034300 (2004-02-01), None
patent: 2004-288784 (2004-10-01), None
patent: 2004-358857 (2004-12-01), None
Precision Engineering Journal of the International Societies for Precision Engineering and Nanotechnology, 25 (2001) pp. 192-199.
Search Report issued in counterpart foreign Taiwanese Application No. 095114106, mailed Jan. 31, 20008.
Partial English translation of Search Report issued in counterpart foreign Taiwanese Application No. 095114106, mailed Jan. 31, 20008.
English language abstract of TW 368465, 1999.
English language abstract of TW 476700, published Feb. 21, 2002.
English language abstract of TW 458882, published Oct. 11, 2001.
English language abstract of TW 200413159, 2004.
English language abstract of JP 2004-034300, published Feb. 5, 2004.
Stephen Y. Chou et al., “Nanoimprint Lithography”, J. Vac. Sci. Technol. B, vol. 14, No. 6, pp. 4129-4133 (1996).
Office Action in U.S. Appl. No. 11/415,130 mailed Feb. 4, 2008.
Office Action in U.S. Appl. No. 11/404,799 mailed Feb. 6, 2008.
German Office Action issued on Aug. 3, 2007, in related Application No. 10 2006 021 507.9.
English translation of German Office Action issued on Aug. 3, 2007, in related Application No. 10 2006 021 507.9.
English Abstract of JP Publication No. 2004-288784 published on Oct. 14, 2004.
Machine translation of JP Publication No. 2004-288784 2004.
Machine translation of JP Publication No. 2004-034300, 2004.
English Abstract of JP Publication No. 2004-358857 published on Dec. 24, 2004.
Machine translation of JP Publication No. 2004-358857, 2004.
Office Action in Korean Application No. 10-2006-34744, 2007.
English translation of Korean Office Action (KR Appl. No. 10-2006-34744) , 2007.
Notice of Allowance issued in U.S. Appl. No. 11/404,799 mailed Jul. 9, 2008.
Notice of Allowance issued in U.S. Appl. No. 11/415,130 mailed Aug. 12, 2008.
Ishibashi Kentaro
Kokubo Mitsunori
DLA Piper (US) LLP
Gupta Yogendra
Nguyen Thu Khanh T
Toshiba Kikai Kabushiki Kaisha
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