Transceiver module with a clipping device used in an optical...

Details Transceiver module with a clipping device used in an optical... Transceiver module with a clipping device used in an optical...

2002-02-07

2004-08-03

Bovernick, Rodney (Department: 2874)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C385S088000, C385S089000

Reexamination Certificate

active

06769818

ABSTRACT:

BACKGROUND OF INVENTION
1. Field of the Invention
The present invention relates to a transceiver module used in an optical fiber communications system. Specifically, the present invention discloses a transceiver module with a clipping device for the optical fiber communications system.
2. Description of the Prior Art
In recent years, technology of optical fiber communications has had obvious growth and advancement. A frequency of light waves is higher than a frequency of radio waves. Therefore, systems which utilize light functioning as a carrier wave have broad bandwidth to transmit a substantial amount of information and messages.
Please refer to FIG.
1
.
FIG. 1
is an exploded diagram of a transceiver module
10
used in an optical fiber communications system according to the prior art. The transceiver module
10
comprises a housing
18
, a connector
12
for connecting with the housing
18
, an optical sub assembly (OSA)
14
installed within the connector
12
for receiving or emitting optical signals, and a printed circuit board (PCB)
16
installed within the housing
18
for processing photoelectric signals. The OSA
14
comprises an optical emitter
22
having a first end
36
connected to an optical fiber so as to transmit optical signals to the optical fiber, and an optical receiver
24
having a first end
38
connected to the optical fiber so as to receive optical signals from the optical fiber. Furthermore, the optical emitter
22
and the optical receiver
24
each comprise a second end having four pins
32
and
34
for electrically connecting to the PCB
16
.
Please refer to FIG.
2
through FIG.
3
C.
FIG. 2
is a vertical view of the optical sub assembly
14
connected to the printed circuit board
16
of the transceiver module
10
depicted in FIG.
1
.
FIG. 3A
is a side view of the optical sub assembly
14
connected to the printed circuit board
16
of the transceiver module
10
depicted in
FIG. 2
along a dotted line
3
—
3
.
FIG. 3B
is a side view of the transceiver module
10
depicted in
FIG. 2
along the dotted line
3
—
3
when the optical sub assembly
14
connects to the printed circuit board
16
under an unfavorable process such as welding or soldering.
FIG. 3C
is a side view of the transceiver module
10
depicted in
FIG. 2
along the dotted line
3
—
3
which utilizes a plurality of printed circuit boards
16
to overlap so as to connect the optical sub assembly
14
with the printed circuit board
16
. As shown in FIG.
2
and
FIG. 3A
, the pins
32
and
34
of the optical receiver
24
and the optical emitter
22
of the OSA
14
are electrically connected to the PCB
16
for the transmission of photoelectric signals in the optical fiber communications system. The pins
32
and
34
of the optical emitter
22
and the optical receiver
24
are usually soldered or welded onto the PCB
16
according to the prior art. Design of the transceiver module
10
must obey a regulation of Small Form-factor Pluggable Transceiver Multi-Source Agreement, which states that there must be a distance
50
between centers of the optical receiver
24
or the optical emitter
22
and the center of the PCB
16
. A space of a certain range must be maintained, and this results in the pins
32
or
34
of the optical emitter
22
or the optical receiver
24
not matching the position of the PCB
16
. Therefore, front ends of the pins
32
or
34
of the optical receiver
22
or the optical emitter
24
need to be deformed or connected with soft lines so as to connect with the PCB
16
by a soldering or welding process.
As shown in
FIG. 3B
, when the pins
32
or
34
of the optical receiver
22
or the optical emitter
24
are soldered or welded onto the PCB
16
, the soldering or welding process causes PCB
16
to depart from its original center after connection with the pins
32
or
34
of the optical receiver
22
or the optical emitter
24
. A fixed end
40
positioned at the end of PCB
16
connected with the housing
18
will result in a situation of bad contact, and the transmission of the photoelectric signals will be incorrectly transmitted. Additionally, the pins
32
or
34
of the optical receiver
22
or the optical emitter
24
are formed of slim metal lines. When the optical fiber communications system
10
is used for several years, welding points or soldering points of the pins
32
or
34
connected with the PCB
16
cause the pins
32
or
34
to become loose or broken by the weight of the PCB
16
.
As shown in
FIG. 3C
, the prior art utilizes a plurality of PCBs
16
to overlap so as to obey the regulation of Small Form-factor Pluggable Transceiver Multi-Source Agreement, which states that there must be the distance
50
between the centers of the optical receiver
24
or the optical emitter
22
and the center of the PCB
16
. A space of the certain range is achieved by overlapping the plurality of PCBs
16
so that the pins
32
or
34
of the optical emitter
22
or the optical receiver
24
match the PCB
16
. For aforementioned reasons, some extra PCBs
16
need to be installed within the optical fiber communications system
10
, thus increasing the cost of the optical fiber communications system
10
.
SUMMARY OF THE INVENTION
It is therefore a primary objective of the claimed invention to provide a transceiver module with a clipping device used in an optical fiber communications system for solving the abovementioned problems.
The claimed invention discloses a transceiver module for an optical fiber communications system. The optical fiber communications system comprises a housing, a connector for connecting with the housing, an optical sub assembly (OSA) installed within the connector for receiving or emitting optical signals, a printed circuit board (PCB) installed within the housing for processing photoelectric signals, and a clipping device disposed within the housing for fixing the OSA so that the OSA is electrically connected with the PCB.
It is an advantage of the claimed invention that the clipping device has a fixing function for the transceiver module and a function of changing shape for the pins of the optical sub assembly so as to connect touching points or surfaces of the printed circuit board in accordance with a uniform standard.
These and other objectives and advantages of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings.


REFERENCES:
patent: 5980324 (1999-11-01), Berg et al.
patent: 6264481 (2001-07-01), Kozel et al.
patent: 6347954 (2002-02-01), Jones et al.

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