Trace-pad interface for improved signal quality

Details Trace-pad interface for improved signal quality Trace-pad interface for improved signal quality

2007-09-11

2007-09-11

Vigushin, John B. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C333S033000, C333S034000, C174S260000, C174S261000, C257S786000

Reexamination Certificate

active

09739252

ABSTRACT:
A method of routing or laying out signal traces on printed wire or circuit board in order to improve signal transmission quality. The method includes routing a given signal trace such that it is electrically connected to a rectangular corner of a substantially wider component pin pad and forms an angle of approximately 135 degrees with the proximate sides of the pad, thereby minimizing the impedance discontinuity at the interface or junction of the signal trace and pad and hence minimizing the reflection of the digital signal at the interface or junction.

REFERENCES:
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patent: 5424492 (1995-06-01), Petty et al.
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patent: 5530623 (1996-06-01), Sanwo et al.
patent: 5541565 (1996-07-01), Dowsing et al.
patent: 6008538 (1999-12-01), Akram et al.
patent: 6091155 (2000-07-01), Jonaidi

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