Tower-type heat pipe and method for making the same

Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material

Reexamination Certificate

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Details

C165S104330, C361S700000, C361S697000, C174S015200, C257S714000

Reexamination Certificate

active

07032653

ABSTRACT:
A tower-type heat pipe (10) includes a metal plate (20), a heat pipe with a container (30) and a wick (32), and a cover (40). The heat pipe is vertically mounted on the metal plate. A solder (50) is used to soldering an outer wall of the container with the metal plate and a top of the container with the cover. An air gap (27) is defined in the metal plate and located between the solder and the wick along a flowing path of the solder in order to prevent the solder from flowing into an inside of the container to contaminate the wick.

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patent: 5632158 (1997-05-01), Tajima
patent: 6336497 (2002-01-01), Lin
patent: 6725909 (2004-04-01), Luo
patent: 6793009 (2004-09-01), Sarraf
patent: 6827133 (2004-12-01), Luo
patent: 6907918 (2005-06-01), Connors et al.
patent: 2005/0019234 (2005-01-01), Luo
patent: 2005/0199374 (2005-09-01), Hsu
patent: 2005/0199375 (2005-09-01), Hsu
patent: 2005/0224215 (2005-10-01), Hsu
patent: 2005/0224216 (2005-10-01), Hsu
patent: 2005/0247436 (2005-11-01), Hsu
patent: 53-22650 (1978-03-01), None

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