Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-06-26
2007-06-26
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C257S719000, C024S458000, C024S513000
Reexamination Certificate
active
11079851
ABSTRACT:
A heat sink retention assembly for retaining a heat sink in thermal contact with a CPU while transmitting load away from the CPU. The heat sink retention assembly includes a frame sized to receive the heat sink, the frame including opposing pin capture channels and a wire module. The wire module includes an upper handle section and a lower pivoting section. The wire module is pivotably coupled to the frame at the lower pivoting section. The wire module further includes opposing end pins, wherein each pin is moveably retained within and extends through a corresponding pin capture channel such that when the wire module is rotated with respect to the frame, the pins travel within their respective channels in order to engage the heat sink.
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Barina Richard M.
French Michael D.
Herring Dean F.
Scavuzzo John P.
Wormsbecher Paul A.
Carey Rodriguez Greenberg & Paul LLP
Chervinsky Boris
Greenberg, Esq. Steven M.
McKinley, Esq. Martin
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