Topside sealing of integrated circuit device

Details Topside sealing of integrated circuit device Topside sealing of integrated circuit device

1984-08-03

1987-08-11

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

4271264, 437236, 437241, H01L 21318

Patent

active

046865594

ABSTRACT:
An improved topside sealing of integrated circuit devices is disclosed which provided for hermetically sealing the top surface of the device comprising depositing a sealing layer of a nitride compound directly on the surface to be sealed. In a preferred embodiment, a protective layer may then be deposited over the nitride layer without any intervening masking steps being necessary.

REFERENCES:
patent: 4194934 (1980-03-01), Blaske
patent: 4283439 (1981-08-01), Higashinakagawa et al.
patent: 4396934 (1983-08-01), Nishida
patent: 4516313 (1985-05-01), Tyri
Gardiner et al, "Al.sub.2 O.sub.3 Protection of S.sub.3 N.sub.4 During, RF Sputtering Etching" IBM TDB, vol. 13, No. 12, May 1971, p. 3657.

Affiliated with

Also associated with

Rating

Topside sealing of integrated circuit device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Topside sealing of integrated circuit device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Topside sealing of integrated circuit device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-406233