Top of die chip-on-board encapsulation

Details Top of die chip-on-board encapsulation Top of die chip-on-board encapsulation

1996-05-02

1999-09-14

Lorin, Francis J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

26427211, B29C 4134

Patent

active

059518138

ABSTRACT:
A processing method that encapsulates the top of a chip-on-board module in a manner that permits rework of the module or removal of integrated circuits used therein. The method comprises the steps of providing a chip-on-board module having a substrate and an integrated circuit disposed thereon, applying a first encapsulant material to a top surface of the a chip-on-board module to cover the integrated circuit except for wire bond spans and wire bonds on the substrate, and applying a second encapsulant material to the wire bond spans and wire bonds on the substrate. The first encapsulant material may be epoxy or polyimide, while the second encapsulant material comprises may be parylene or silicon nitride, for example. The second encapsulant material may be readily removed by cleaning the module with oxygen plasma etching, for example, which does not affect the underlying first encapsulant material, and is removed without damaging the integrated circuit or circuits of the module.

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