Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Device held in place by clamping
Patent
1995-08-03
1996-11-26
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Device held in place by clamping
257 48, 257697, 257738, 361759, 361801, 361829, H01L 2334, H01L 2348
Patent
active
055788700
ABSTRACT:
A ball grid array socket with rows of electrical contacts that extend through holes in a plate. The arrangement of the holes and the electrical contacts provides an entry hole. The contacts are arranged with ends that are cupped to mate with the side and top of the ball contacts of the ball grid array package. The contact surface of the ball grid array package is vertically inserted without any interfering structure. The plate is spring loaded is such a way that the plate is driven parallel to the plane of the ball contacts in a manner that reduces the entry hole opening. This reduced entry opening is arranged and constructed such that with a ball contact insert therein electrical conductivity is provided between the ball contact and the electrical contact, and further where the cupped ends of the electrical contact retain the ball within the hole. The edges of the hole and the top of the cupped electrical contact are chamfered to mate with the curved sides of the ball contact. When force is applied vertically driving the ball contacts into the chamfered edges the hole enlarges allowing the ball to penetrate the hole. As the ball contacts enter deeper into the hole the cupped ends of the electrical contacts ride over the ball such that the ball is retained in a detent fashion. A spring force is provided that is directed to drive the plate and electrical contacts together to reduce the hole. This spring force provides the force necessary to maintain electrical connections between the ball contacts and the electrical contacts of the socket. Pulling the integrated circuit away from the socket over comes the spring force to allow extraction of the integrated circuit. In another embodiment a lever arm is provides that, when activated, drives the plate horizontally compressing the spring and enlarging the entry hole. Releasing the lever arm allows the spring to close and retain the ball grid array integrated circuit. The cupped ends of the electrical contacts are designed to mate with a solid angle at the side/top of the ball contact such that the integrate package is retained within the socket while making electrical connections. The cup is angled to fit on top of the ball and extend between the ball and the IC package such that the ball grid array itself is retained in the socket. In all said arrangements the integrated circuit has unimpeded top entry and exit.
REFERENCES:
patent: 4381131 (1983-04-01), Demnianiuk
patent: 4937655 (1990-06-01), Miyazaki
patent: 5006792 (1991-04-01), Malhi et al.
patent: 5045923 (1991-09-01), Matsuoka
patent: 5302853 (1994-04-01), Volz et al.
patent: 5349236 (1994-09-01), Oshino et al.
patent: 5451816 (1995-09-01), Abe et al.
Farnsworth Jeffery A.
Harper Patrick H.
Hooley Robert
Chow Stephen Y.
Cohen Jerry
Osterowski David
Paul Edwin H.
Precision Connector Designs, Inc.
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