Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Device held in place by clamping
Patent
1996-06-03
1997-07-08
Whitehead, Carl W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Device held in place by clamping
257780, 439331, H01L 2348, H01L 2352, H01L 2940, H01L 2334
Patent
active
056464479
ABSTRACT:
A socket for a ball grid array integrated circuit package (BGA) with an array of electrical contacts (*12) that extend through holes in a slidable plate. The arrangement of spacing the holes (14) and the electrical contacts therein provide entry openings that allow the ball contacts (16) of a BGA package to enter the openings. The contacts are cupped or angled to mate with the side and top of the ball contacts of the ball grid array package. The contact surface of the ball grid array package is vertically inserted into the socket without any interfering structure, and there are guide surfaces to align the ball contacts with the openings. The plate (3) is driven parallel to the plane of the ball contacts in a manner that reduces the entry hole opening by means of a rotating cam placed at one end rotated by a torsion spring. This reduced entry opening is arranged and constructed such that with a ball contact inserted therein, electrical conductivity is provided between the ball contact and the socket electrical contact, and further contact occurs where the cupped ends are bifurcated with sharp edges that penetrate any oxidation on the ball contacts. The angled or cupped ends (24) of the socket contacts mate with the ball contacts near where the ball contacts attach to the BGA package body. This mating is at or above the equator of the ball contacts and serves to retain the ball and the BGA package itself in the socket. No other forces are acting on the BGA package. Torsion springs provide the rotation force via a cam handle to rotate the cam from a position for package insertion to one of ball contact electrical connection with socket contacts. The lid of the socket is a frame around an opening through which the BGA package enters. This frame contacts the cam handle and pressing down on the frame provides the driving force that rotates the cam to the open position allowing the slidable plate to move toward the low profile of the cam with aid of a compression spring. When the torsion springs rotate the cam axle from the open position to the actuated position and the slidable plate drives the BGA contacts into contact with the socket contacts, the BGA package is retained for test or burn-in or other uses. The open position for BGA insertion also allows BGA removal. Operation is that the lid is pushed down and the BGA package is guided with no or zero insertion force into the socket where the ball contacts enter the holes. Releasing the pressure allows the cam to rotate to the larger cam profile causing the slidable plate to be driven and the ball contacts to be pinched between the socket contact angled ends and the side wall surfaces of the holes thereby retaining the BGA package within the socket and making reliable electrical connections to the ball contacts.
REFERENCES:
patent: 4692790 (1987-09-01), Oyamada
patent: 5451816 (1995-09-01), Abe et al.
patent: 5545050 (1996-08-01), Sato et al.
Chinnock Paul S.
Ramsey James Michael
Ryan Maria E.
Clark S. V.
Cohen Jerry
Paul Edwin H.
PCD Inc.
Whitehead Carl W.
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