Top layers of metal for high performance IC's

Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – With particular signal path connections

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S207000, C257S208000, C257SE23145

Reexamination Certificate

active

07465975

ABSTRACT:
A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.

REFERENCES:
patent: 3823349 (1974-07-01), Dhaka et al.
patent: 4152195 (1979-05-01), Bahrle et al.
patent: 4188636 (1980-02-01), Sato et al.
patent: 4242336 (1980-12-01), Hasegawa et al.
patent: 4423547 (1984-01-01), Farrar et al.
patent: 4618878 (1986-10-01), Aoyama et al.
patent: 4723197 (1988-02-01), Takiar et al.
patent: 4830974 (1989-05-01), Chang et al.
patent: 4881144 (1989-11-01), Yuito et al.
patent: 4978419 (1990-12-01), Nanda et al.
patent: 4980034 (1990-12-01), Volfson et al.
patent: 5016461 (1991-05-01), Walker et al.
patent: 5055907 (1991-10-01), Jacobs
patent: 5083187 (1992-01-01), Lamson et al.
patent: 5106461 (1992-04-01), Volfson et al.
patent: 5130457 (1992-07-01), Sanders et al.
patent: 5194928 (1993-03-01), Cronin et al.
patent: 5212403 (1993-05-01), Nakanishi et al.
patent: 5262353 (1993-11-01), Sun et al.
patent: 5338696 (1994-08-01), Ilderem et al.
patent: 5360524 (1994-11-01), Hendel et al.
patent: 5384488 (1995-01-01), Golshan et al.
patent: 5436412 (1995-07-01), Ahmad et al.
patent: 5468984 (1995-11-01), Efland et al.
patent: 5489303 (1996-02-01), Sasaki et al.
patent: 5501006 (1996-03-01), Gehman, Jr. et al.
patent: 5514006 (1996-05-01), Getselis et al.
patent: 5559055 (1996-09-01), Chang et al.
patent: 5563086 (1996-10-01), Bertin et al.
patent: 5635767 (1997-06-01), Wenzel et al.
patent: 5659201 (1997-08-01), Wollesen
patent: 5665639 (1997-09-01), Seppala et al.
patent: 5686560 (1997-11-01), Lee
patent: 5686764 (1997-11-01), Fulcher
patent: 5719448 (1998-02-01), Ichikawa
patent: 5726499 (1998-03-01), Irinoda
patent: 5739560 (1998-04-01), Toyoda et al.
patent: 5742075 (1998-04-01), Burns et al.
patent: 5760429 (1998-06-01), Yano et al.
patent: 5763954 (1998-06-01), Hyakutake
patent: 5767010 (1998-06-01), Mis et al.
patent: 5767546 (1998-06-01), Williams et al.
patent: 5773888 (1998-06-01), Hosomi et al.
patent: 5783483 (1998-07-01), Gardner
patent: 5789303 (1998-08-01), Leung et al.
patent: 5818110 (1998-10-01), Cronin
patent: 5827776 (1998-10-01), Bandyopadhyay et al.
patent: 5827778 (1998-10-01), Yamada
patent: 5834844 (1998-11-01), Akagawa et al.
patent: 5861328 (1999-01-01), Tehrani et al.
patent: 5861675 (1999-01-01), Sasaki et al.
patent: 5874779 (1999-02-01), Matsuno
patent: 5894170 (1999-04-01), Ishikawa
patent: 5900668 (1999-05-01), Wollesen
patent: 5910020 (1999-06-01), Yamada
patent: 5924005 (1999-07-01), Waldo
patent: 5934844 (1999-08-01), Woolley
patent: 5939790 (1999-08-01), Gregoire et al.
patent: 5944537 (1999-08-01), Smith et al.
patent: 5953626 (1999-09-01), Hause et al.
patent: 5959424 (1999-09-01), Elkmann et al.
patent: 5963840 (1999-10-01), Xia et al.
patent: 5965903 (1999-10-01), Chittipeddi et al.
patent: 5969424 (1999-10-01), Matsuki et al.
patent: 5986764 (1999-11-01), Nonaka
patent: 5989991 (1999-11-01), Lien
patent: 6001538 (1999-12-01), Chen et al.
patent: 6001673 (1999-12-01), Marcinkiewicz
patent: 6016000 (2000-01-01), Moslehi
patent: 6020640 (2000-02-01), Efland et al.
patent: 6025275 (2000-02-01), Efland et al.
patent: 6025639 (2000-02-01), Mitwalsky et al.
patent: 6031257 (2000-02-01), Noto et al.
patent: 6033939 (2000-03-01), Agarwala et al.
patent: 6046502 (2000-04-01), Matsuno et al.
patent: 6046503 (2000-04-01), Weigand et al.
patent: 6087250 (2000-07-01), Hyakutake
patent: 6100548 (2000-08-01), Nguyen et al.
patent: 6103552 (2000-08-01), Lin
patent: 6107674 (2000-08-01), Zommer
patent: 6124198 (2000-09-01), Moslehi
patent: 6124912 (2000-09-01), Moore
patent: 6130457 (2000-10-01), Yu et al.
patent: 6130481 (2000-10-01), Harada et al.
patent: 6133582 (2000-10-01), Osann, Jr. et al.
patent: 6137155 (2000-10-01), Seshan et al.
patent: 6144100 (2000-11-01), Shen et al.
patent: 6146985 (2000-11-01), Wollesen
patent: 6150725 (2000-11-01), Misawa et al.
patent: 6150726 (2000-11-01), Feilchenfeld et al.
patent: 6160297 (2000-12-01), Shimizu et al.
patent: 6169019 (2001-01-01), Takagi
patent: 6174393 (2001-01-01), Scheifele
patent: 6175156 (2001-01-01), Mametani et al.
patent: 6184138 (2001-02-01), Ho et al.
patent: 6184143 (2001-02-01), Ohashi et al.
patent: 6187680 (2001-02-01), Costrini et al.
patent: 6207486 (2001-03-01), Nishiyama
patent: 6218223 (2001-04-01), Ikeda et al.
patent: 6218318 (2001-04-01), Ohkura et al.
patent: 6229221 (2001-05-01), Kloen et al.
patent: 6261944 (2001-07-01), Mehta et al.
patent: 6272736 (2001-08-01), Lee
patent: 6278174 (2001-08-01), Havemann et al.
patent: 6288442 (2001-09-01), Farrar
patent: 6294451 (2001-09-01), Yoshizawa
patent: 6300234 (2001-10-01), Flynn et al.
patent: 6303423 (2001-10-01), Lin
patent: 6303977 (2001-10-01), Schroen et al.
patent: 6324048 (2001-11-01), Liu
patent: 6326673 (2001-12-01), Liou
patent: 6335104 (2002-01-01), Sambucetti et al.
patent: 6346471 (2002-02-01), Okushima
patent: 6348733 (2002-02-01), Lin
patent: 6350705 (2002-02-01), Lin
patent: 6359328 (2002-03-01), Dubin
patent: 6370768 (2002-04-01), Itabashi
patent: 6376374 (2002-04-01), Stevens
patent: 6383916 (2002-05-01), Lin
patent: 6392300 (2002-05-01), Koike
patent: 6417575 (2002-07-01), Harada et al.
patent: 6436814 (2002-08-01), Horak et al.
patent: 6441487 (2002-08-01), Elenius et al.
patent: 6455880 (2002-09-01), Ono et al.
patent: 6455885 (2002-09-01), Lin
patent: 6459135 (2002-10-01), Basteres et al.
patent: 6472745 (2002-10-01), Iizuka
patent: 6489647 (2002-12-01), Lin
patent: 6495442 (2002-12-01), Lin et al.
patent: 6518092 (2003-02-01), Kikuchi
patent: 6538326 (2003-03-01), Shimizu et al.
patent: 6544880 (2003-04-01), Akram
patent: 6555459 (2003-04-01), Tokushige et al.
patent: 6583043 (2003-06-01), Shroff et al.
patent: 6593649 (2003-07-01), Lin et al.
patent: 6605524 (2003-08-01), Fan et al.
patent: 6605549 (2003-08-01), Leu et al.
patent: 6614091 (2003-09-01), Downey et al.
patent: 6614099 (2003-09-01), Farrar
patent: 6620728 (2003-09-01), Lin
patent: 6649509 (2003-11-01), Lin et al.
patent: 6657310 (2003-12-01), Lin
patent: 6673704 (2004-01-01), Wada et al.
patent: 6707159 (2004-03-01), Kumamoto et al.
patent: 6709973 (2004-03-01), Sakamoto
patent: 6710460 (2004-03-01), Morozumi
patent: 6713381 (2004-03-01), Barr et al.
patent: 6717159 (2004-04-01), Novak
patent: 6720212 (2004-04-01), Robl et al.
patent: 6756295 (2004-06-01), Lin et al.
patent: 6762115 (2004-07-01), Lin et al.
patent: 6798073 (2004-09-01), Lin et al.
patent: 6800555 (2004-10-01), Test et al.
patent: 6818540 (2004-11-01), Martin et al.
patent: 6818546 (2004-11-01), Saito et al.
patent: 6838769 (2005-01-01), Chittipeddi et al.
patent: 6864562 (2005-03-01), Toyosawa et al.
patent: 6900545 (2005-05-01), Sebesta et al.
patent: 6965165 (2005-11-01), Lin
patent: 6984891 (2006-01-01), Ahn et al.
patent: 7091616 (2006-08-01), Suminoe et al.
patent: 2001/0035452 (2001-11-01), Test et al.
patent: 2002/0017730 (2002-02-01), Tahara et al.
patent: 2002/0024142 (2002-02-01), Sekiguchi
patent: 2002/0158334 (2002-10-01), Vu et al.
patent: 2003/0102551 (2003-06-01), Kikuchi
patent: 2005/0260849 (2005-11-01), Lin
patent: 2005/0266612 (2005-12-01), Lin
patent: 01-135043 (1989-05-01), None
patent: 01-183836 (1989-07-01), None
patent: 01-184848 (1989-07-01), None
patent: 01-184849 (1989-07-01), None
patent: 04-316351 (1992-11-01), None
Stanley Wolf, Silicon Processing for the VLSI Era vol. 2: Process Integration, Lattice Press, Sunset Beach, CA, pp. 214-285, Copyright 1990.
Stanley Wolf, Silicon Processing for the VLSI Era vol. 2: Process Integration, Lattice Press, Sunset Beach, CA, USA copyright 1990, pp. 214-217, 282-285.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Top layers of metal for high performance IC's does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Top layers of metal for high performance IC's, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Top layers of metal for high performance IC's will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4023663

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.