Top contact LED thermal management

Details Top contact LED thermal management Top contact LED thermal management

2008-07-31

2011-12-20

Le, Thao (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

C438S026000

Reexamination Certificate

active

08080827

ABSTRACT:
An LED having enhanced heat dissipation is disclosed. For example, an LED die can have extended bond pads that are configured to enhance heat flow from an active region of the LED to a lead frame. A heat transmissive substrate can further enhance heat flow away from the LED die. By enhancing heat dissipation, more current can be used to drive the LED. The use of more current facilitates the production of brighter LEDs.

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PCT search report of Nov. 2, 2009 for PCT/US09/56401.

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