Top contact LED thermal management

Details Top contact LED thermal management Top contact LED thermal management

2010-02-03

2011-12-27

Le, Thao (Department: 2892)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C257S079000, C257S099000, C257SE33075, C257SE33066

Reexamination Certificate

active

08084283

ABSTRACT:
An LED having enhanced heat dissipation is disclosed. For example, an LED die can have extended bond pads that are configured to enhance heat flow from an active region of the LED to a lead frame. A heat transmissive substrate can further enhance heat flow away from the LED die. By enhancing heat dissipation, more current can be used to drive the LED. The use of more current facilitates the production of brighter LEDs.

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