Tooling frame able to adhere to tin

Details Tooling frame able to adhere to tin Tooling frame able to adhere to tin

2005-10-04

2005-10-04

Stoner, Kiley S. (Department: 1725)

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By brush, wick, or pad

C228S049500

Reexamination Certificate

active

06951299

ABSTRACT:
A tooling frame with an ability to adhere to tin is disclosed, which is a frame structure used to support a circuit board passing through a stannic furnace to be soldered. The tooling frame is characterized in that a tin adhesive apparatus having a tin adhesive material is mounted at an appropriate location of the tooling frame so as to suck surplus tin on said circuit board both after the circuit board is transported through the stannic furnace for tin filling and during tin shedding and to improve quality of soldering.

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