Static molds – Including means within surface to confine heat exchange medium – Mold part of particular material
Patent
1993-04-13
1994-10-25
Woo, Jay H.
Static molds
Including means within surface to confine heat exchange medium
Mold part of particular material
249 79, 249111, 264 22, 264225, B29C 3302, B29C 3340
Patent
active
053582110
ABSTRACT:
Tooling for use in forming articles and a method for making same wherein the tooling includes a mold. The mold has a mold surface having an interior and an exterior. A plurality of metallic strands are positioned adjacent to the interior of the mold surface. The mold further includes at least one metallic heat transfer tube for containing a fluid cooling agent. One or more heat transfer rods can also be positioned in the mold. A layer of a plastic material is placed adjacent the interior of the mold surface. The plastic material surrounds the metallic strands and the metallic heat transfer tubes and rods. When heat is produced on the mold during a molding operation, the heat is transferred through the metallic strands and the heat exchange tubes and rods. The heat is dissipated by the cooling affect caused by the cooling fluid in the tubes. The method of the present invention includes the steps of: (a) applying a first layer of a plastic material on a form mold to form a mold surface, the mold surface having an interior and an exterior; (b) placing a plurality of metallic strands near the interior of the mold surface after curing the first layer; (c) positioning at least one metallic heat transfer tube in communication with the metallic strands; (d) applying additional plastic material to cover the metallic strands and the heat transfer tubes; and (e) releasing the mold from the form mold. Preferably the mold halves are received and supported by metal bases.
REFERENCES:
patent: 3880563 (1975-04-01), DeVos
patent: 4105184 (1978-08-01), Sumitomo
patent: 5130161 (1992-07-01), Mansur et al.
patent: 5260014 (1993-11-01), Holton et al.
Aeroquip Corporation
Davis Robert B.
Woo Jay H.
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