Tooling and method for joining a heel pad to a floor mat

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156 735, 156290, 1563084, 1565801, B29C 6506, B29C 6508

Patent

active

059388730

ABSTRACT:
A tool for vibrationally joining a heel pad to a floor mat includes a platen having a first region and a second region. A first plurality of pins may extend from the first region of the platen, and a second plurality of pins may extend from the second region of the platen. The first plurality of pins are arranged non-parallel to the second plurality of pins. The method of joining a heel pad to a floor mat includes applying a glue between the heel pad and the floor mat, and thereafter vibrationally welding the heel pad and floor mat such that a perimeter region of the heel pad is recessed lower than an interior region of the heel pad. In another aspect of the subject invention, a perimeter region of a heel pad may be joined to a floor mat includes ultrasonically welding a portion of the perimeter or rim region of the heel pad to the floor mat, and thereafter ultrasonically welding the remaining portion of the perimeter region of the heel pad to the floor mat.

REFERENCES:
patent: 2723937 (1955-11-01), Rice
patent: 4247587 (1981-01-01), Cherault
patent: 4497854 (1985-02-01), Milner et al.
patent: 4576848 (1986-03-01), Dillon et al.
patent: 4721641 (1988-01-01), Bailey
patent: 4749602 (1988-06-01), Russel
patent: 4758457 (1988-07-01), Altus
patent: 4798639 (1989-01-01), Yamaguchi
patent: 4828898 (1989-05-01), Bailey
patent: 4871602 (1989-10-01), Luker
patent: 4904319 (1990-02-01), Divincenzo et al.
patent: 5026445 (1991-06-01), Malnolfi et al.
patent: 5269860 (1993-12-01), Rice
patent: 5411616 (1995-05-01), Desai et al.
patent: 5439725 (1995-08-01), Roberts
patent: 5468335 (1995-11-01), Mainolfi et al.
patent: 5705003 (1998-01-01), Farrow et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Tooling and method for joining a heel pad to a floor mat does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Tooling and method for joining a heel pad to a floor mat, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tooling and method for joining a heel pad to a floor mat will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-311894

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.