Tool for removing soldered IC packages

Details Tool for removing soldered IC packages Tool for removing soldered IC packages

1983-03-25

1984-12-04

Hall, Carl E.

Metal fusion bonding

With means to remove, compact, or shape applied flux or filler

29764, 228106, 228264, B23K 100, B23P 1904

Patent

active

044859589

ABSTRACT:
A tool for removing soldered IC packages comprises a block of heat-conducting material having a plurality of cylinder-shaped holes with parallel axes; a plurality of heat-conducting rods, each of which has one end that slides in a respective one of said holes; an insulator containing the block having a lid with another plurality of holes which are aligned with at least some of the rods in the block; and means for moving the rods that align with the holes in the lid partway through such holes by distances of unequal length so they can conduct heat from the block to respective I/O pins on the package that lie in multiple planes.

REFERENCES:
patent: 3632972 (1972-01-01), Halstead
patent: 3669333 (1972-06-01), Coucoulas
patent: 3746239 (1976-07-01), Auray
patent: 3990863 (1976-11-01), Palmer

Affiliated with

Also associated with

Rating

Tool for removing soldered IC packages does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Tool for removing soldered IC packages, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tool for removing soldered IC packages will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1578703