Tool for removing soldered components

Metal working – Means to assemble or disassemble – Means to disassemble electrical device

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29743, 228 561, H05K 300

Patent

active

045862524

ABSTRACT:
Apparatus is presented for removing a faulty component from a printed circuit board when attachment is by a plurality of input/output pins that extend outwardly from the component and protrude through holes in the printed circuit board where they are then soldered to printed circuitry. Removal is accomplished by clamping the printed circuit board in a fixture which includes a container of molten solder together with aligning and retaining elements which support the board over the surface of the molten solder so as to bring the protruding tips of the input/output pins into contact therewith. Above the clamped down printed circuit board a movable trolley is situated on a beam located parallel to and several inches above the printed circuit board. Extending downward from the trolley is a tubular metal bellows on the lower end of which is a rubber suction cup. The upper end of the bellows connects via flexible tubing to a vacuum pumping source. The trolley is moved along the beam until the suction cup can be made to contact the top surface of the faulty component. Application of a vacuum causes the tubular bellows to shrink in length creating a uniform pulling force on the component which draws it free from the printed circuit board as soon as the solder is melted from the downward extending pins.

REFERENCES:
patent: 3377689 (1968-04-01), Kimmett
patent: 3731866 (1973-05-01), Mason et al.
patent: 4274576 (1981-06-01), Shariff
patent: 4506820 (1985-03-01), Brucker
patent: 4528746 (1985-07-01), Yoshimura

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Tool for removing soldered components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Tool for removing soldered components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tool for removing soldered components will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1567622

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.