Tool for removing integrated circuit packages

Metal working – Means to assemble or disassemble – Means to disassemble electrical device

Patent

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Details

29278, H05K 1304, H05K 330

Patent

active

041528271

ABSTRACT:
The tool includes a limiting block, on one side of which is affixed a first gripping arm for grasping a first underside of the IC package. A second gripping arm is engagable with the second side of the limiting block for grasping the second underside of the IC package. Positioned above the limiting block, between the inner surfaces of the gripping arms, is an alignment head which supports the removal tool on the upper surface of the printed circuit board and positions the gripping arms in proper position to grasp the undersides of the IC package. Positioned above the alignment head and journaled between the gripping arms is a cylindrical cam having eccentric pivot points. To remove an IC package from a socket, the tool is positioned on the PC board with the legs of the alignment head straddling the ends of the IC socket. The second gripping arm is then engaged, causing the first and second gripping arms to grip opposite undersides of the IC package. After engaging the second gripping arm, the cam is rotated 180 degrees by means of an attached lever, the cam rotation perpendicularly raising both gripping arms away from the alignment head and thereby producing a uniform perpendicular force on each of the gripping arms to effect the removal of the IC package from the socket.

REFERENCES:
patent: 2513821 (1950-07-01), Schneider
patent: 3538580 (1970-11-01), Bruner
patent: 3797092 (1974-03-01), Einarson
patent: 3974556 (1976-08-01), Kubik

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