Cleaning and liquid contact with solids – Processes – With treating fluid motion
Reexamination Certificate
2005-12-13
2005-12-13
Kornakov, M. (Department: 1746)
Cleaning and liquid contact with solids
Processes
With treating fluid motion
C134S034000, C134S109000, C134S111000, C134S108000, C134S184000, C134S195000, C134S902000, C034S364000, C034S576000
Reexamination Certificate
active
06974505
ABSTRACT:
A cleaning tool for cleaning substrates, comprising a circulation conduit through which is circulated a cleaning liquid or gas. The circulation conduit is disposed in fluid communication with an upstream flow chamber and a downstream cleaning chamber, the cross-sectional area of which cleaning chamber is less than the cross-sectional area of the flow chamber. In use, the cleaning chamber receives a wafer substrate for cleaning of particles or removal of polymer films from the substrate. The smaller cross-sectional area of the cleaning chamber accelerates the flow of a cleaning fluid flowing through the cleaning chamber from the flow chamber. The rapidly-flowing cleaning fluid removes the particles and/or films from the substrate while preventing dropping of the removed particles or re-deposition of the film back onto the substrate. A particle filter may be provided in the circulation conduit downstream of the cleaning chamber for removing the particles.
REFERENCES:
patent: 5009240 (1991-04-01), Levi
patent: 5948173 (1999-09-01), Huh et al.
Chou Chun-Li
Hsieh Ming-Hong
Shih Hsin-Ching
Tao Hong-J.
Kornakov M.
Taiwan Semiconductor Manufacturing Co. Ltd.
Tung & Associates
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