Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2011-05-17
2011-05-17
Wyrozebski, Kat (Department: 1746)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S060000, C156S064000, C156S228000, C156S230000, C156S232000, C156S234000, C156S290000, C156S298000, C156S299000, C156S303100, C156S349000, C156S350000, C156S378000, C156S379000, C156S580000
Reexamination Certificate
active
07943002
ABSTRACT:
A tool and a method for packaging lens module are provided. The method for packaging lens module includes the following steps. Firstly, a carrier having at least one cavity is provided. Next, a holder is disposed in the cavity. Then, a die is disposed on a surface of a substrate. After that, the substrate is inversely placed on the carrier, wherein the surface where the die is disposed faces the carrier, and the die corresponds to the holder. Then, a cover plate covers the carrier and the substrate, such that the substrate is fixed on the holder.
REFERENCES:
patent: 7166907 (2007-01-01), Onishi et al.
patent: 2006/0084254 (2006-04-01), Attarwala
patent: 2008/0121784 (2008-05-01), Chang et al.
patent: 2935188 (2007-08-01), None
Advanced Semiconductor Engineering Inc.
Bacon & Thomas PLLC
Rivera Joshel
Wyrozebski Kat
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