Metal working – Barrier layer or semiconductor device making
Patent
1996-09-23
1997-07-22
Graybill, David E.
Metal working
Barrier layer or semiconductor device making
29705, 29762, H01L 2168
Patent
active
056499817
ABSTRACT:
An apparatus for use in a removable tab procedure whereby tabs (7) are affixed to the pads (3) by initially having the bonding surface as flat as possible so that bonding pressures from pad to pad are relatively uniform. Bonding is preformed with the pressure applied to the pads being such that the tabs can later be easily removed without damage to the die pads, yet sufficiently strong so that the tabs do not come loose during burn in and testing. A bond strength pull between about 5 and about 40 grams per pad is appropriate for this purpose. The tabs are removed by placing the tested die (1) and attached tabs in a fixture (11) and providing a tool (31) dimensioned and moved along a path (13, 15, 17, 19) whereby each of the tabs is serially removed with the pressure applied to each tab to provide removal being preferably no greater than 40 grams. In this manner, since only one tab is removed at a time, there is no requirement that the extraction tool provide a great force to the die, thus minimizing the possibility of a greater than acceptable force being applied to any one tab for removal.
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IBM Technical Disclosure Bulletin; "Chip/Tape of Tape/Lead Frame Interface Delamination Technique"; vol. 32, No. 8A, Jan., 1990, p. 468.
Arnold Richard W.
Darnell Lloyd W.
Braden Stanton C.
Brady III W. James
Donaldson Richard L.
Graybill David E.
Texas Instruments Incorporated
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