Toning and solvent washout process for making conductive interco

Details Toning and solvent washout process for making conductive interco Toning and solvent washout process for making conductive interco

1978-02-13

1979-06-05

Smith, Ronald H.

Coating processes

Electrical product produced

Welding electrode

29625, 96 362, 156253, 156272, 156285, 156649, 427 97, 427 98, 427301, 427307, 428901, B05D 306

Patent

active

041574079

ABSTRACT:
By the process of this invention, two layer printed circuits having conductive interconnections are prepared by applying a photoadhesive layer to a substrate bearing an electrically conductive circuit pattern, exposing the photoadhesive layer to a circuit image related to the circuit pattern to produce adherent circuit image areas having segments thereof, e.g., pad areas, overlying segments of the electrically conductive circuit pattern, applying metal, alloy or plating catalyst powder, e.g., copper, to the adherent image areas, exposing the metallized or catalytic circuit pattern to an image of the overlying segments of the previous circuit patterns, removing the overlying segment areas of the photoadhesive layer with a suitable solvent, and treating the metallized surface by plating, e.g., electrolessly plating, or by soldering. Multilayer printed circuits can also be prepared by repeating these steps with additional layers of photoadhesive material adhered to underlying printed circuits.

REFERENCES:
patent: 3615471 (1971-10-01), Lenoble et al.
patent: 3778900 (1973-12-01), Haining et al.
patent: 3934334 (1976-01-01), Hanni
patent: 3934335 (1976-01-01), Nelson
patent: 4023999 (1977-05-01), Linberg et al.
patent: 4052787 (1977-10-01), Shaheen et al.
patent: 4054479 (1977-10-01), Peiffer
patent: 4054483 (1977-10-01), Peiffer

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