Patent
1985-09-24
1986-08-12
Edlow, Martin H.
357 231, 357 67, 357 71, H01L 2978, H01L 2350, H01L 2352, H01L 2962
Patent
active
046059474
ABSTRACT:
An MOS device having a gate electrode and interconnect of titanium nitride and especially titanium nitride which is formed by low pressure chemical vapor deposition. In a more specific embodiment the titanium nitride gate electrode and interconnect have a silicon layer thereover to improve oxidation protection.
REFERENCES:
patent: 3879746 (1975-04-01), Fournier
patent: 4141022 (1979-02-01), Sigg et al.
Pintchovski Fabio
Price J. B.
Seelbach Christian A.
Tobin Philip J.
Edlow Martin H.
Fallick E.
Fisher John A.
Motorola Inc.
LandOfFree
Titanium nitride MOS device gate electrode and method of produci does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Titanium nitride MOS device gate electrode and method of produci, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Titanium nitride MOS device gate electrode and method of produci will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1947273